Test microstructures for measurement of SiC thin film mechanical properties-Reference-Cited by-同舟云学术

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Test microstructures for measurement of SiC thin film mechanical properties

Published:1999-01-01 Issue:2 Volume:9 Page:190-193
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Serre Christophe,Pérez-Rodríguez Alejandro,Romano-Rodríguez Albert,Morante Joan R,Esteve Jaume,Acero María Cruz

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Integrated fabrication of polysilicon mechanisms

2. Integrated movable micromechanical structures for sensors and actuators

3. Microfabricated hinges

4. Stress-profile characterization and test-structure analysis of single and double ion-implanted LPCVD polycrystalline silicon

5. Mechanical properties of 3C silicon carbide

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tensile mechanical behaviors of cubic silicon carbide thin films;Computational Materials Science;2012-09

2. Nanoindentation of laser micromachined 3C-SiC thin film micro-cantilevers;Materials & Design;2011-06

3. A Methodology for Accurately Measuring Mechanical Properties on the Micro-Scale;Strain;2011-05-05

4. Determination of Young’s moduli of 3C (110) single-crystal and (111) polycrystalline silicon carbide from operating frequencies;Journal of Materials Science;2008-07

5. Fracture Strength of Single-Crystal Silicon Carbide Microspecimens at 24 $^{\circ}\hbox{C}$ and 1000 $^{\circ}\hbox{C}$;Journal of Microelectromechanical Systems;2008-02

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