Polysilicon MEMS accelerometers exposed to shocks: numerical–experimental investigation-Reference-Cited by-同舟云学术

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Polysilicon MEMS accelerometers exposed to shocks: numerical–experimental investigation

Published:2009-02-23 Issue:3 Volume:19 Page:035023
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Ghisi Aldo,Kalicinski Stanislaw,Mariani Stefano,De Wolf Ingrid,Corigliano Alberto

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Fundamentals of Microfabrication

2. Multi-scale Analysis of MEMS Sensors Subject to Drop Impacts

3. A three-scale FE approach to reliability analysis of MEMS sensors subject to impacts

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength;Micromachines;2023-02-13

2. Characterization of SOI MEMS capacitive accelerometer under varying acceleration shock pulse durations;Microsystem Technologies;2021-05-12

3. A Method for Over 100,000 G Impact Test on Nanoscale Film;2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS);2021-01-25

4. On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams;Micro & Nano Letters;2020-12

5. Analysis of the vulnerability of MEMS tuning fork gyroscope during the gun launch;Microelectronics Reliability;2020-04

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