3D probe array integrated with a front-end 100-channel neural recording ASIC-Reference-Cited by-同舟云学术

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3D probe array integrated with a front-end 100-channel neural recording ASIC

Published:2014-11-12 Issue:12 Volume:24 Page:125010
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Cheng Ming-Yuan,Yao Lei,Tan Kwan Ling,Lim Ruiqi,Li Peng,Chen Weiguo

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/24/i=12/a=125010/pdf

Reference17 articles.

1. CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording–Characterization and Application

2. A floating 3D silicon microprobe array for neural drug delivery compatible with electrical recording

3. A Low-Power Integrated Circuit for a Wireless 100-Electrode Neural Recording System

4. Integrated wireless neural interface based on the Utah electrode array

5. An implantable wireless neural interface for recording cortical circuit dynamics in moving primates

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A compact, ultrahigh-density headstage with high-fidelity hybrid integration for large-scale deep-brain opto-electrophysiology;2023-10-03

2. Manufacturing Processes of Implantable Microelectrode Array for In Vivo Neural Electrophysiological Recordings and Stimulation: A State-Of-the-Art Review;Journal of Micro- and Nano-Manufacturing;2022-12-01

3. Semi-Implantable Bioelectronics;Nano-Micro Letters;2022-05-28

4. A Miniaturized 256-Channel Neural Recording Interface With Area-Efficient Hybrid Integration of Flexible Probes and CMOS Integrated Circuits;IEEE Transactions on Biomedical Engineering;2022-01

5. Opamp-Less Sub-μW/Channel Δ-Modulated Neural-ADC With Super-GΩ Input Impedance;IEEE Journal of Solid-State Circuits;2021-05

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