Author:
Spangler Glenn E,Kolesar Edward S
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
5 articles.
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1. Anodic bonding;International Materials Reviews;2006-10
2. Wafer Bonding Techniques for MEMS;Sensor Letters;2005-12-01
3. Anodic oxidation during electrostatic bonding;Philosophical Magazine;2004-02-21
4. Characterization of Cation Depletion in Pyrex during Electrostatic Bonding;Journal of The Electrochemical Society;2003
5. Systemintegration;Praxiswissen Mikrosystemtechnik