Etched profile control in anisotropic etching of silicon by TMAH+Triton
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Orientation- and concentration-dependent surfactant adsorption on silicon in aqueous alkaline solutions: explaining the changes in the etch rate, roughness and undercutting for MEMS applications
2. Study on anisotropic silicon etching characteristics in various surfactant-added tetramethyl ammonium hydroxide water solutions
3. Ellipsometry study of the adsorbed surfactant thickness on Si{110} and Si{100} and the effect of pre-adsorbed surfactant layer on etching characteristics in TMAH
4. The role of Triton surfactant in anisotropic etching of {1 1 0} reflective planes on (1 0 0) silicon
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