A semi-fixed abrasive machining technique-Reference-Cited by-同舟云学术

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A semi-fixed abrasive machining technique

Published:2009-04-14 Issue:5 Volume:19 Page:054006
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Yuan Julong,Wang Zhiwei,Hong Tao,Deng Qianfa,Wen Donghui,Lv Binghai

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Material Removal Mechanisms in Lapping and Polishing

2. CMOS chip planarization by chemical mechanical polishing for a vertically stacked metal MEMS integration

3. Photoconductivity characterization of silicon wafer mirror-polishing subsurface damage related to gate oxide integrity

4. Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID (Electronic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheels

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of kinematic parameters on lapping uniformity;Materials and Manufacturing Processes;2024-06-26

2. Study on the Friction and Wear Properties of Cast Iron Under Magnetic-Mechanical Coupling Conditions;Experimental Techniques;2024-06-04

3. Study on friction and wear properties of cast iron material in line contact condition based on free abrasive grinding experiment;The International Journal of Advanced Manufacturing Technology;2022-12-23

4. Study on the Preparation and Performance of Self-Regressive Fixed Abrasive Chemical Mechanical Polishing Pad;Machines;2022-10-30

5. A novel polishing process with rigid-flexible composite structure plate for sapphire wafer polishing;The International Journal of Advanced Manufacturing Technology;2022-08-13

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