High-resolution patterning of silver conductive lines by adhesion contrast planography-Reference-Cited by-同舟云学术

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High-resolution patterning of silver conductive lines by adhesion contrast planography

Published:2015-08-06 Issue:9 Volume:25 Page:095002
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Kusaka Yasuyuki,Koutake Masayoshi,Ushijima Hirobumi

Funder

Japan Society for the Promotion of Science

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/25/i=9/a=095002/pdf

Reference33 articles.

1. Recent Advances in Organic Transistor Printing Processes

2. Fabrication of Transistors on Flexible Substrates: from Mass-Printing to High-Resolution Alternative Lithography Strategies

3. Paper Electronics

4. Screen-offset printing for fine conductive patterns

5. Continuous fine pattern formation by screen-offset printing using a silicone blanket

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1. Arc-to-sheet printer for high-precision patterning with positional errors below 6 ppm at 3σ level: Trochoidal trajectory mechanism for rotary motion of arc;Precision Engineering;2023-09

2. Oxide TFTs with S/D-contacts patterned by high-resolution reverse-offset printed resist layers;Flexible and Printed Electronics;2023-03-01

3. Focused Review on Print‐Patterned Contact Electrodes for Metal‐Oxide Thin‐Film Transistors;Advanced Materials Interfaces;2023-01-22

4. Large‐Scale Manufacturing of Pattern‐Integrated Paper Li‐Ion Microbatteries through Roll‐to‐Roll Flexographic Printing;Advanced Materials Technologies;2022-05-18

5. Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers;ACS Applied Materials & Interfaces;2021-08-25

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