Abstract
Abstract
In the field of localized surface plasmon resonance sensing, narrow linewidth, high-quality factor, and high absorptivity have always been the goals that researchers are committed to achieving. The primary methods for achieving this goal are near-field coupling and far-field coupling. Due to the limitations of nanomanufacturing processes, current research often only focuses on single coupling methods such as far-field coupling or near-field coupling, with few relevant reports combining the two coupling methods. Based on this, this paper proposes a single-layer gold nano-disk array structure, which is simple and easy to manufacture. Through modal field analysis and structural parameter adjustment, some significant results have been achieved. On the one hand, the suggested gold nano-disk array structure yields a resonant peak based on far-field coupling with a full width at half maximum (FWHM) of less than 0.05 nm and a figure of merit of more than 15 000
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(the quality factor is more than 20 000). On the other hand, it has been successfully accomplished to combine near-field coupling and far-field coupling, leading to a composite coupling peak that incorporates the benefits of both types of coupling. Moreover, this coupling peak has excellent characteristics such as narrow FWHM (less than 3 nm) and high absorptivity (up to 80.5%), which is superior to most reported sensing structures and more in line with practical sensing application requirements. In this paper, the potential of the gold disk array structure as a high-performance sensing structure is further explored, providing reference and new ideas for the design of easy-to-prepare and high-performance electromagnetic resonance devices.
Funder
Hebei Natural Science Foundation
National Natural Science Foundation of China
Natural Science Foundation of Shandong Province
Fundamental Research Funds for the Central Universities
Applied Basic Research Program Project of Liaoning Province
the Research Fund of State Key Laboratory of Synthetical Automation for Process Industries
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials