Mixed-frequency medium-voltage aging analysis of epoxy in the absence of partial discharges and dielectric heating

Author:

Küchler FlorianORCID,Färber Raphael,Bill Fabian,Renggli Samuel,Franck Christian MORCID

Abstract

Abstract Premature failures of polymeric insulation under inverter-type electrical stress are predominantly associated with partial discharge (PD) erosion or dielectric heating. In the present contribution, an approach for aging analysis in the absence of the aforementioned mechanisms is proposed and applied to anhydride-cured epoxy samples, which are designed with a recessed shape to achieve PD-free aging. Dielectric heating was found to be negligible under all applied experimental conditions. Aging of samples was performed with a specialized setup for the generation of mixed-frequency medium-voltage (MF-MV) waveforms under controlled temperature and humidity conditions. The health state of samples was evaluated before and after different aging sequences by analysis of potential aging markers, namely the short-term AC breakdown strength, the complex dielectric permittivity (real and imaginary part), the volume resistivity, the glass transition temperature and the characteristic absorbance peaks obtained by Fourier-transform infrared spectroscopy (FTIR). Of these, only the breakdown strength exhibited significant aging effects under hygroelectric stress, which is hypothesized to be attributed to localized microcracking caused by electromechanical stress. Pure electrical MF-MV stress (i.e. at room temperature and dry conditions) was not found to be critical under the applied experimental conditions. By means of FTIR, hydrolysis was excluded as a possible aging mechanisms. In summary, the proposed aging analysis approach was found to be suitable to reveal aging effects empirically as well as to give indications about the underlying aging mechanisms without the need for excessively long or accelerated lifetime testing.

Funder

ALTANA AG

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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