On the correlation between the TiN thin film properties and the energy flux of neutral sputtered atoms in direct current magnetron discharge

Abstract

Abstract In this study, the energy flux of sputtered atoms on a substrate was correlated to the properties of titanium nitride (TiN) films deposited using direct current magnetron sputtering (dcMS) under mixed Ar and N2 atmospheres. The neutral titanium sputtered atoms velocity distribution functions (AVDFs) were measured by tunable diode-laser induced fluorescence (TD-LIF), and the flux of particles and their energy were derived. Mass spectrometry was used to characterize the energy-resolved flux of the ions. It was found that the neutral sputtered atoms flux and deposition rate were in good agreement, indicating that the flux of the neutral titanium ground state represents the number of deposited atoms. Moreover, TiN films were deposited at different gas pressures and at various Ar/N2 gas mixtures close to the conditions where stoichiometric TiN was formed, without bias voltage and heating of the substrates. The energy flux of the sputtered neutral Ti into the substrate was calculated from TD-LIF measurements. At a relatively low magnetron discharge pressure of 0.4 Pa, we demonstrated that the energy of sputtered neutral Ti impinging on the substrate is higher than the energy flux of ionized particles corresponding mainly to Ar+. Thus, the influence of the energy flux of the sputtered atoms on the texture and microstructure of the films is revealed. The (200) texture was obtained at 0.4 Pa when the energy flux of the sputtered atoms was higher than the ion energy flux. At 1.3 Pa where the sputtered atoms energy flux is one order lower compared to 0.4 Pa the (111) texture was obtained. The high-energy flux of the ground state of Ti sputtered atoms seems to allow stress removal in the films.