Resonant-cavity-enhanced 4H-SiC thin film MSM UV photodetectors on SiO2/Si substrates

Abstract

Abstract Heterogeneous integration of 4H-SiC film with Si substrate can produce ultraviolet (UV) photodetectors (PD) with higher performance and easier integration with silicon CMOS circuits than homogenous epitaxy of 4H-SiC on SiC substrates. In this study, 1.2 µm thick high-quality single crystalline 4H-SiC thin films were successfully bonded with SiO2/Si (100) substrates using the Smart-Cut technique, achieving bubble-free bonding interfaces and 6.03 MPa bonding strength. UV PDs of metal–semiconductor–metal type with a resonant cavity structure were fabricated for the first time using the heterogenous film sample. The device exhibits a low dark current of 1.6 × 10−13 A in reverse bias of 20 V and a maximum specific detectivity of about 5.2 × 1012 Jones at 280 nm, which is significant for a device with a resonance-enhanced structure. These results demonstrate a promising approach for the fabrication of 4H-SiC devices with silicon CMOS circuits.