Influence of residual stress on the adhesion and surface morphology of PECVD-coated polypropylene-Reference-Cited by-同舟云学术

Influence of residual stress on the adhesion and surface morphology of PECVD-coated polypropylene

Published:2017-10-12 Issue:44 Volume:50 Page:445301
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Jaritz Montgomery,Hopmann Christian,Behm Henrik,Kirchheim Dennis,Wilski Stefan,Grochla Dario,Banko Lars,Ludwig Alfred,Böke Marc,Winter Jörg,Bahre Hendrik,Dahlmann Rainer

Funder

Deutsche Forschungsgemeinschaft (DFG) as part of the Collaborative Research Centre SFB-TR 87

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/1361-6463/aa8798/pdf

Reference44 articles.

1. Deposition of SiOx diffusion barriers on flexible packaging materials by PECVD

2. Permeation barrier properties of thin oxide films on flexible polymer substrates

3. A new encapsulation solution for flexible organic solar cells

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stretch‐tolerant PECVD gas barrier coatings for sustainable flexible packaging;Plasma Processes and Polymers;2024-04-19

2. Review on interfacial bonding enhancement of inorganic thin film on polymer substrate by ion and plasma source;International Journal of Adhesion and Adhesives;2024-02

3. PECVD and PEALD on polymer substrates (part II): Understanding and tuning of barrier and membrane properties of thin films;Plasma Processes and Polymers;2023-11-27

4. PECVD and PEALD on polymer substrates (part I): Fundamentals and analysis of plasma activation and thin film growth;Plasma Processes and Polymers;2023-10-30

5. Design of organic/inorganic multilayer water vapor barrier thin films deposited via plasma polymerization for encapsulation;Thin Solid Films;2023-02