Constructing van der Waals heterostructures by dry-transfer assembly for novel optoelectronic device

Author:

Li Huihan,Xiong XiaoluORCID,Hui Fei,Yang Dongliang,Jiang Jinbao,Feng Wanxiang,Han Junfeng,Duan Junxi,Wang Zhongrui,Sun LinfengORCID

Abstract

Abstract Since the first successful exfoliation of graphene, the superior physical and chemical properties of two-dimensional (2D) materials, such as atomic thickness, strong in-plane bonding energy and weak inter-layer van der Waals (vdW) force have attracted wide attention. Meanwhile, there is a surge of interest in novel physics which is absent in bulk materials. Thus, vertical stacking of 2D materials could be critical to discover such physics and develop novel optoelectronic applications. Although vdW heterostructures have been grown by chemical vapor deposition, the available choices of materials for stacking is limited and the device yield is yet to be improved. Another approach to build vdW heterostructure relies on wet/dry transfer techniques like stacking Lego bricks. Although previous reviews have surveyed various wet transfer techniques, novel dry transfer techniques have been recently been demonstrated, featuring clean and sharp interfaces, which also gets rid of contamination, wrinkles, bubbles formed during wet transfer. This review summarizes the optimized dry transfer methods, which paves the way towards high-quality 2D material heterostructures with optimized interfaces. Such transfer techniques also lead to new physical phenomena while enable novel optoelectronic applications on artificial vdW heterostructures, which are discussed in the last part of this review.

Funder

Beijing Natural Science Foundation

National Key Research and Development Program of China

Beijing Institute of Technology Research Fund Program for Young Scholars

Hong Kong Research Grant Council-Early Career Scheme

National Natural Science Foundation of China-Excellent Young Scientists Fun

National Natural Science Foundation of China

National Key R&D Program of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Reference164 articles.

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