Intra-wire coupling in segmented Ni/Cu nanowires deposited by electrodeposition-Reference-Cited by-同舟云学术

Intra-wire coupling in segmented Ni/Cu nanowires deposited by electrodeposition

Published:2017-01-09 Issue:6 Volume:28 Page:065709
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Sergelius Philip,Lee Ji Hyun,Fruchart Olivier,Salem Mohamed Shaker,Allende Sebastian,Escobar Roberto Alejandro,Gooth Johannes,Zierold Robert,Toussaint Jean-Christophe,Schneider Sebastian,Pohl Darius,Rellinghaus Bernd,Martin Sylvain,Garcia Javier,Reith Heiko,Spende Anne,Toimil-Molares Maria-Eugenia,Altbir Dora,Cowburn Russel,Görlitz Detlef,Nielsch Kornelius

Funder

Financiamiento Basal para Centros Cientficos y Tecnolgicos de Excelencia

Seventh Framework Programme

Fondo Nacional de Desarrollo Cientfico y Tecnolgico

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/28/i=6/a=065709/pdf

Reference65 articles.

1. Nanomagnet logic: progress toward system-level integration