Fracture strength and failure mechanism of graphene-containing grain boundaries and pores

Author:

Wang ShuaiweiORCID,Zhang Cun,Chen ShaohuaORCID,Peng ZhilongORCID

Abstract

Abstract Grain boundaries and pores commonly manifest in graphene sheets during experimental preparation. Additionally, pores have been intentionally incorporated into graphene to fulfill specific functions for various applications. However, how does the simultaneous presence of pores and grain boundaries impact the mechanical properties of graphene? This paper establishes uniaxial tension models of single-layer graphene-containing pores and three types of experimentally observed. The effect of interaction between pores and grain boundaries on the fracture strength of graphene was studied respectively for three types of grain boundaries by employing molecular dynamics simulations and considering factors such as pore size, the distance between pores and grain boundaries, and loading angle. A competitive mechanism between the intrinsic strength of pristine graphene with grain boundaries (referred to as pristine GGBs), which varies with the loading angle and the fracture strength of graphene sheets with pores that changes with the size of the pores, governs the fracture strength and failure modes of GGBs with pores. When the former exceeds the latter, the fracture strength of GGBs with pores primarily depends on the size of the pores, and fractures occur at the edges of the pores. Conversely, when the former is lower, the fracture strength of GGBs with pores relies on the loading angle and the distance between pores and grain boundaries, leading to grain boundary rupture. If the two strengths are comparable, the failure modes are influenced by the distance between pores and grain boundaries as well as the loading angle. The findings further elucidate the impact of coexisting grain boundaries and pores on the fracture behavior of graphene, providing valuable guidance for the precise design of graphene-based devices in the future.

Funder

NSFC

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

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