AuAg nanocomposites suppress biofilm-induced inflammation in human osteoblasts

Author:

Lee Chiang-WenORCID,Lin Zih-Chan,Chiang Yao-Chang,Li Sin-Yu,Ciou Jyun-JiaORCID,Liu Kuan-Wen,Lin Yu-Ching,Huang Bo-Jie,Peng Kuo-Ti,Fang Mei-Ling,Lin Tzu-En,Liao Mei-YiORCID,Lai Chian-HuiORCID

Abstract

Abstract Staphylococcus aureus (S. aureus) forms biofilm that causes periprosthetic joint infections and osteomyelitis (OM) which are the intractable health problems in clinics. The silver-containing nanoparticles (AgNPs) are antibacterial nanomaterials with less cytotoxicity than the classic Ag compounds. Likewise, gold nanoparticles (AuNPs) have also been demonstrated as excellent nanomaterials for medical applications. Previous studies have showed that both AgNPs and AuNPs have anti-microbial or anti-inflammatory properties. We have developed a novel green chemistry that could generate the AuAg nanocomposites, through the reduction of tannic acid (TNA). The bioactivity of the nanocomposites was investigated in S. aureus biofilm-exposed human osteoblast cells (hFOB1.19). The current synthesis method is a simple, low-cost, eco-friendly, and green chemistry approach. Our results showed that the AuAg nanocomposites were biocompatible with low cell toxicity, and did not induce cell apoptosis nor necrosis in hFOB1.19 cells. Moreover, AuAg nanocomposites could effectively inhibited the accumulation of reactive oxygen species (ROS) in mitochondria and in rest of cellular compartments after exposing to bacterial biofilm (by reducing 0.78, 0.77-fold in the cell and mitochondria, respectively). AuAg nanocomposites also suppressed ROS-triggered inflammatory protein expression via MAPKs and Akt pathways. The current data suggest that AuAg nanocomposites have the potential to be a good therapeutic agent in treating inflammation in bacteria-infected bone diseases.

Funder

MOST

NCHU ENABLE Center

Ministry of Science and Technology of Taiwan

Chang Gung University of Science Foundation

Chang Gung Medical Research Program Foundation

National Chung Hsing University

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

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