Enhanced thermal conductivity and lower density composites with brick-wall microstructure based on highly oriented graphite nanoplatelet: towards manufacturable cooling substrates for high power density electronic devices-Reference-Cited by-同舟云学术

Enhanced thermal conductivity and lower density composites with brick-wall microstructure based on highly oriented graphite nanoplatelet: towards manufacturable cooling substrates for high power density electronic devices

Published:2019-04-01 Issue:24 Volume:30 Page:245204
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Zhang Minghao^ORCID,Wang Huatao^ORCID,Su Zhiwei,Tian Cong,Zhang John Tao,Wang Yu,Yan Feng,Mai Zhihong,Xing Guozhong

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://iopscience.iop.org/article/10.1088/1361-6528/ab0638/pdf

Reference61 articles.

1. Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials

2. Thermal Challenges in Next-Generation Electronic Systems

3. Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

4. Carbon nanotube composites for thermal management

5. Optical visualization and polarized light absorption of the single-wall carbon nanotube to verify intrinsic thermal applications

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