Optimization of the technological curing modes of glass fiber reinforced composites

Author:

Chen Yangyang,Maung Pyi Phyo,Malysheva G.V.

Abstract

Abstract The aim of this study was to optimize the curing mode of glass fiber reinforced epoxy composites. In this article, the change of the thermos-physical characteristics of epoxy binders depending on the state of aggregation of the binders during their curing is investigated. The kinetic parameters of the epoxy binders used are determined. The obtained thermos-physical and kinetic parameters were used to simulate the process of curing fiberglass. Different modes of curing for fiberglass based on epoxy binders were simulated at different heating rates. The method of optimization of the curing mode was carried out. As the result of the calculations, it was found that the optimal mode: the heating rate in the first section 2 °C/min and in the third section 3 °C/min.

Publisher

IOP Publishing

Subject

General Medicine

Reference13 articles.

1. Investigation of the structure of an encapsulated anaerobic adhesive;Zorin;Polymer Science Series D.,2014

2. Manifestation of a synergistic effect in technological heredity;Baurova;Polymer Science Series D.,2016

3. Modeling of the temperature and stressed-strained states of the reflector of a mirror space antenna;Reznik;Eng Phys Thermophy.,2015

4. Multiscale modeling of the binder polymer composite materials heating using microwave radiation;Prosuntsov;Journal of Physics Conference Series.,2015

5. Theoretical Principles of Determining the Longitudinal Thermal Conductivity of Thin-Walled Structural Elements from Composite Materials;Reznik;Eng. Phys. Thermophy.,2014

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