Comparative Study of Plastic Strain Accumulations at Thermal Cycles for Solder Alloys-Reference-Cited by-同舟云学术

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Comparative Study of Plastic Strain Accumulations at Thermal Cycles for Solder Alloys

Published:2018-10-26 Issue: Volume:416 Page:012092
ISSN:1757-899X
Container-title:IOP Conference Series: Materials Science and Engineering
language:
Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.

Author:

Vălean C,Linul E

Publisher

IOP Publishing

Subject

General Medicine

Link

http://stacks.iop.org/1757-899X/416/i=1/a=012092/pdf

Reference10 articles.

1. Constitutive equations for hot-working of metals

2. An internal variable constitutive model for hot working of metals

3. Viscoplastic Anand model for solder alloys and its application

4. Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints

5. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

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