Mechanical robustness of cryogenic temperature sensors packaged in a flat, hermetically-sealed package
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Published:2015-12-18
Issue:
Volume:101
Page:012153
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ISSN:1757-8981
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Container-title:IOP Conference Series: Materials Science and Engineering
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language:
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Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.
Cited by
1 articles.
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1. Recent Progress in Instrumentation for Large to Medium Scale Facilities Operating at 4 K Temperature Level;Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022;2023