Parametric identification of thermophysical characteristics of heat-protective decaying materials

Author:

Aldebenev N S,Yu Ganigin S,Demoretsky D A,Diligenskaya A N,Yu Livshits M

Abstract

Abstract The paper presents a method of identifying the thermophysical properties of heat-protective materials of complex multi-component composition used in structures to meet the specified requirements for their resistance to external temperature influence. The research is dedicated to the study of a thermal barrier coating material containing chemically active components that enter into a chemical decomposition process, accompanied by the heat absorption. The equivalent specific heat capacity of the material reflects its thermophysical properties, taking into account the endothermic reaction. The equivalent specific heat capacity is identified by solving the inverse heat conduction problem using the results of temperature measurement in a multi-layer structure element during the thermophysical experiment. Regularization of this incorrect inverse problem is performed when it is transformed into a mini-max parametric problem of semi-infinite optimization. The results of differential thermal analysis and known qualitative laws of endothermic reactions make it possible to narrow the set of feasible solutions to the level of a compact set of piecewise continuous functions of a special structure, which provides a reduction to the parametric optimization problem. The minimax problem is solved by an alternance optimization method. The results obtained confirm the effectiveness of the proposed method for solving applied problems.

Publisher

IOP Publishing

Subject

General Medicine

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3