Preparation of Latent Curing Agent for Epoxy Resin by Encapsulation Technology

Abstract

Abstract The microcapsule-type curing agents DDM-PMMA and IZ-PU were prepared by solvent evaporation method and interfacial polymerization method, respectively. The surface morphology of the two microcapsules was characterized by SEM. The coating efficiency and latency were analyzed by DSC analysis of the one-component adhesive composed of the microcapsule-type curing agent and epoxy resin. Two encapsulation methods were compared in terms of hydrophilicity or lipophilicity of the core material, formation time of the microcapsules, coating efficiency and latency of the microcapsules.