Structure, thermal stability and mechanical properties of composite wires made of conducting microalloyed aluminum alloys

Author:

Nokhrin A V,Shadrina I S,Chuvil’deev V N,Bobrov A A,Kopylov V I,Berendeev N N,Piskunov A V

Abstract

Abstract Thermal stability of the structure and mechanical properties of composite wires made of microalloyed aluminum alloys were studied. The wire was produced by co-rolling of the copper-coated aluminum alloy. It has been demonstrated that annealing at 200 °C for 200 hours leads to the onset of recrystallization, reduced hardness and strength of the wire as per the Hall-Petch equation. The grain size in the annealed wire was less than 1 -2 μm, manifesting the stabilized effect of precipitates of Al3(Sc,Zr) phases. At that the rate of diffusion of copper into the aluminum was quite low. The formation of a uniform fine-grained structure and zero copper-induced embrittlement resulted in increased by up to ∼10% plasticity of the wire.

Publisher

IOP Publishing

Subject

General Medicine

Reference6 articles.

1. Multifunctional properties of composition graded Al wires;Yang;Scripta Materialia,2020

2. Fatigue properties of ultra-fine grained Al-Mg-Si wires with enhanced mechanical strength and electrical conductivity;Medvedev;Materials,2018

3. Study of structure and mechanical properties of fine-grained aluminum alloys Al-0.6wt.%Mg-Zr-Sc with ratio Zr:Sc=1.5 obtained by cold drawing;Nokhrin;Materials,2019

4. Elaboration of architectured copper clad aluminum composites by a multi-step drawing Process;Moisy;Materials Science Forum,2018

5. Light conducting materials for aircraft wires;Matveyev;Cables and Wires,2006

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