Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
https://iopscience.iop.org/article/10.1088/1757-899X/530/1/012019/pdf
Reference12 articles.
1. Reflow-oven-processing of pressureless sintered-silver interconnects;Wereszczak;J. Mater. Process. Technol.,2018
2. Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan;Najib;Int. J. Heat Mass Transf.,2015
3. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints;Pan,2009
4. Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven;Illés,2009
5. Heating characteristics of convection reflow ovens;Illés,2009
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1. Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations;Journal of Materials Research and Technology;2024-05
2. Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven;Symmetry;2023-09-11
3. Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology;Microelectronics International;2021-10-04
4. Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles;Discrete Dynamics in Nature and Society;2021-06-16
5. Research on Temperature Change of Reflow Furnace Based On Mathematical Modeling;IOP Conference Series: Earth and Environmental Science;2021-05-01
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