Sacrificial ion beam etching process for seed layer removal of 6 μm pitch CuSn micro bumps
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Published:2012-12-06
Issue:
Volume:41
Page:012005
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ISSN:1757-8981
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Container-title:IOP Conference Series: Materials Science and Engineering
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language:
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Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.