Fabrication and Structural Characterization of Co-implanted Ultra Shallow Junctions for Integration in Piezoresistive Silicon Sensors Compatible with CMOS Processing
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Published:2013-12-16
Issue:
Volume:51
Page:012004
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ISSN:1757-8981
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Container-title:IOP Conference Series: Materials Science and Engineering
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language:
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Short-container-title:IOP Conf. Ser.: Mater. Sci. Eng.
Author:
Ahmed S,Mustafa R