Cohesive Zone Modeling for Predicting Interfacial Delamination in over mold Components

Abstract

Abstract Delamination is one among the significant issues in over molding and electronic packaging. Notably, because of material compatibility and also the weak adhesion-strength of interfaces makes it complex. Typically, delamination takes place at the bimaterial interfaces. In order to predict interface delamination, the cohesive zone technique may be applied as an attainable tool. However, the proper alternative of the cohesive parameters still forms an obstacle for the general usage. The objectives of the work, analytical & numerical modeling of delamination of interfaces between molding compound and metal frames and its subsequent validation using numerical double cantilever beam test and four-point bend tests. In this work, the double cantilever beam and four-point bend tests are used to obtain the strain energy release rate of mode I and mode II values, these values are used as parameters for the cohesive zone method.