Effects of Fe, Si, and Cu on Recrystallization Behavior in High Purity Aluminum Foil

Author:

Yamanoi T

Abstract

Abstract The correlation between the recrystallization behavior of high purity aluminum foil, which is used as the electrode material of electrolytic capacitors, and the influence of Fe, Si, and Cu contents on the formation of recrystallization texture was systematically investigated. The following results were obtained: (1) Room-temperature recrystallization, which occurs during cold rolling of the highest-purity material, was suppressed by adding approximately 10 mass ppm of Fe, Si, and Cu. The effect was strongest for Cu, followed by that for Si and Fe. (2) The main component of texture after the final heat treatment changed in the order {001}<100>→ {011 }<411>→> {126}<411>→ {123}<412> as the purity of the aluminum foil decreased. In particular, {126}<411> was an characteristic orientation for extremely coarse grains and was considered to have originated from the rolling texture (β-fiber). This coarse grain growth was considered to be related to the decrease in the growth rate of the recrystallized grains depending on the purity of the matrix.

Publisher

IOP Publishing

Subject

General Medicine

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