Melting of W/Cu flat type component for main limiter and its impact on plasma operation in EAST experiments

Author:

Xuan Chuannan,Zhu Dahuan,Gao Binfu,Yan Rong,Guo Zongxiao,Ding RuiORCID,Wang Baoguo,Zi Pengfei,Wang Yang,Chen Junling,

Abstract

Abstract A type of actively cooled W/Cu flat-type component with high heat exhaust capacity was installed as limiter during the EAST spring plasma campaign in 2022, aiming to support the long pulse operation. Unfortunately, severe melting phenomena with obvious droplets ejection of the flat-type W/Cu limiter was repeatedly monitored by CCD and IR cameras, which not only induced the failure of component but also seriously influenced plasma operation. The high temperature around midplane of W/Cu flat-type main limiter is identified to be closely connected with ICRF induced fast ions loss. Indeed, the surface temperature of W/Cu flat-type main limiter was too high to ignore. The damage of flat-type structure, however, usually started between the joint interface of W plates and CuCrZr heat sink material. Such damage would in turn lead to the gradual increase of surface temperature which eventually would cause melting of W plates. Once melting events occurred on the W/Cu flat-type main limiter, the vast majority of cases would result in plasma disruption. Moreover, the damage of main limiter would rapidly deteriorate. Hence, more attention should be paid to how to improve the fatigue lifetime of the joint interface. Such test results of flat-type W/Cu component for limiter are important references for the improvement and application of W/Cu flat-type component for high heat flux area in fusion devices.

Funder

National Natural Science Foundation of China

Collaborative Innovation Program of Hefei Science Center, CAS

National Key R&D Program of China

Open Fund of Magnetic Confinement Fusion Laboratory of Anhui Province

the Anhui Provincial Natural Science Foundation

Key Research Program of Frontier Sciences, CAS

CASHIPS Director’s Fund

the Youth Innovation Promotion Association of Chinese Academy of Sciences

Publisher

IOP Publishing

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