Modelling of double air-bridged structured inductor implemented by a GaAs integrated passive device manufacturing process
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0268-1242/32/i=5/a=055002/pdf
Reference22 articles.
1. Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films
2. 2.4-GHz Complementary Metal Oxide Semiconductor Power Amplifier Using High-Quality Factor Wafer-Level Bondwire Spiral Inductor
3. Significantly Enhanced Inductance and Quality Factor of GHz Integrated Magnetic Solenoid Inductors With FeGaB/ ${\rm Al}_{2}{\rm O}_{3}$ Multilayer Films
4. Design and comparison of flipped active inductors with high quality factors
5. A high performance compact Wilkinson power divider using GaAs-based optimized integrated passive device fabrication process for LTE application
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