1. Research on the shear strength of Sn-Ag-Cu solder joints in microelectronic packaging;Gu;Semiconductor Technology,2005
2. Test on the shear strength of solder joints of BGA packaged devices;Xue;Transactions of the China Welding Institution,2005
3. The effect of aging on the shear strength and fracture mode of BGA lead-free solder joints;Wang;Welding Quality Control and Management,2010
4. The morphology of intermetallic compounds in rapidly solidified Sn2.5Ag0.7Cu solder and its effect on solder joint properties;Zhao;The Chinese Journal of Nonferrous Metals,2010