Design and implementation of microcirculation cooling device for microelectronic devices based on electrostatic force

Abstract

Abstract This paper presents the design of a cooling device for microelectronic device applications. The proposed device uses parallel plate capacitor electrical bias to generate an electrostatic force that acts on the coolant to enable control of the coolant flow in the radiator. Through a combination of the structural design of the device and the application of an electrical bias on both sides of multiple parallel plate capacitor electrodes, the generation of a radiator coolant eddy current is realized, and the functions of cooling and heat transfer are realized for microelectronic devices placed on the surface of the base platform. Based on this principle, a finite element multi-physical field simulation was used to simulate the flow heat transfer function of the coolant in the device under the action of the electrostatic force and the effects of the channel diameter, channel spacing, voltage, and liquid storage tank depth on the peak coolant velocity were studied. In addition, 3D printing technology was used to fabricate the heat dissipation device. The heat dissipation device was tested by charging, with a basic realization of the function of controlling the cooling liquid flow in the heat dissipation device demonstrated. The device realizes radiator coolant flow rate control through voltage control and has characteristics that include low energy consumption and a convenient and compact structure.