Study of Thermal Conductivity of Fluorinated Graphene

Abstract

Abstract With the rapid development of technology and the advent of the 5G era in recent years, the heat dissipation of electronic devices has received great attention. However, the high intrinsic conductivity of ordinary graphene materials limits their potential applications in electronic packaging materials because of their poor thermal management. The results show that fluorinated graphene has excellent heat resistance, corrosion resistance, and strong wear resistance. It can also play a role in lubrication and is commonly used in high-temperature coatings, wear-resistant lubrication coatings and corrosion-resistant coatings because it does not react easily with other substances. Due to the strong electronegativity of fluorine, fluorinated graphene has strong stability and oxidation resistance at high temperatures. Therefore, in this paper, a fluorinated graphene with high compressibility, high thermal conductivity, and high electrical insulation was developed by hydrothermal method assisted by hydrofluoric acid, and the effect on the thermal conductivity of fluorinated graphene was investigated by changing the fluorine-to-carbon ratio (F/C) by adjusting the hydrofluoric acid content. The structure of fluorinated graphene was characterized by SEM and XRD, which proved to be porous and a customized interconnected graphene network with adjustable fluorine coverage. The prepared fluorinated graphene has good insulating properties with a minimum conductivity of 4×10-7 S cm-1 and a thermal conductivity of 1.254 W m-1 K-1, which has been confirmed by the electrical conductivity test results. Meanwhile, because of the porous structure of graphene fluoride, we prepared epoxy resin/fluorinated graphene nanocomposites by vacuum-assisted infiltration process using epoxy resin as the filler material. This material and fluorinated graphene showed outstanding thermal performance during the typical cooling process. The conclusion shows that graphene fluoride and epoxy resin/fluorinated graphene nanocomposites are promising for electronic packaging.