Numerical modelling of physical processes and structural changes in metals under intensive irradiation with use of CRS code: dislocations, twinning, evaporation and stress waves
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
http://stacks.iop.org/1742-6596/552/i=1/a=012002/pdf
Reference27 articles.
1. Dynamic fracture of copper under the action of a relativistic high-current electron beam
2. Simulation of generation of ultradisperse particles upon irradiation of metals by a high-power electron beam
3. Dislocation based high-rate plasticity model and its application to plate-impact and ultra short electron irradiation simulations
4. A simple mechanical model for grain boundary sliding in nanocrystalline metals
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Formation of Aluminum-Copper Composite Using High-Current Electron Beam Irradiation;2019 IEEE 9th International Conference Nanomaterials: Applications & Properties (NAP);2019-09
2. Molecular Dynamics Investigation of Dislocation Slip in Pure Metals and Alloys;Structural Integrity;2019
3. Comparative study of shock-wave hardening and substructure evolution of 304L and Hadfield steels irradiated with a nanosecond relativistic high-current electron beam;Journal of Alloys and Compounds;2017-08
4. Continuum model of tensile fracture of pure aluminum and D16 alloy and its application to the shock wave problems;Journal of Physics: Conference Series;2016-11
5. Simulation and experimental investigation of the spall fracture of 304L stainless steel irradiated by a nanosecond relativistic high-current electron beam;International Journal of Fracture;2016-02-18
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3