Study of temperature conduction processes in sandwich structures

Author:

Zou Duoyijia,Chang Geng,Du Wei,Pan Xuchao

Abstract

Abstract The sandwich structure is a common protective design that has been extensively used in the field of protection, but few studies have been done on its multilayer temperature conduction characteristics. Based on one typical sandwich protective structure, a temperature conduction model is established. The IMEX method is used to solve the established model, and then the attenuation rate of the temperature field with changes in the protective structure’s dimensions is theoretically calculated. Simultaneously, a simulation experimental platform is set up, and temperature conduction experiments are conducted. The results show that the theoretical model could describe the temperature conduction process of the sandwich structure, and the experimental results are in good agreement with the theoretical calculations; when the structural parameters are fixed, the temperature of each layer of the material increased gradually with time and finally tended to be stabilized. The rate of change of temperature is the largest in 0 s ~ 200 s; when the parameters are fixed in time, the temperature decreases gradually with the change of spatial position and finally tends to be stabilized. The thermal conduction rate of each layer of the material determines its change. The temperature change rate of the heat insulation layer and air layer is relatively high. The research can provide support and reference for the design of sandwich temperature protection structures.

Publisher

IOP Publishing

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3