Author:
Li Xiang,Gao Tianming,Guo Shuhan,Li Yang,Huo Shixing,Wang Hengrui,Li Shuai,Zhang Tao,Li Shu
Abstract
Abstract
A method based on cellular automata was established to simulate the solidification process of solder balls used in ball grid array (BGA) packaging technology. For the uniform and constant temperature distribution inside the droplets, the equiaxed crystal morphology and the equiaxed crystal solute field were studied. The simulation results are also shown for solidification process with the BGA tin-lead solder ball prepared by uniform droplet spray (UDS) process under the condition that the cooling rate of is invariable.
Subject
General Physics and Astronomy
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