Simulation study of modular independent cooling systems for servers

Author:

Jia Deyi,He Wei,Xu Chenchen,Guo Tao

Abstract

Abstract With the development of information technology, IT equipment within data centers is becoming increasingly dense, leading to a continuous increase in heat flux density. In order to significantly enhance the cooling efficiency of servers, this study proposes a server-level modular independent cooling system, which integrates the cooling system’s end devices completely within the servers. Compared to traditional room-level air conditioning cooling schemes, this approach avoids unnecessary cooling during the cooling transfer process, thereby improving energy usage efficiency and data center space utilization. Additionally, it allows for independent adjustment based on the actual load and temperature requirements of each server. This research provides new insights for optimizing server design.

Publisher

IOP Publishing

Reference10 articles.

1. Analysis of server heat dissipation challenge of diverse computing power [J];Li;Information Communication Technology and Policy,2024

2. Development and discussion of liquid-cooled data center engineering technology [J];Cao;Intelligent Building and Smart City,2024

3. Research on Optimization of Air cooling system for electronic Chip in Limited Space [J];Guo;Energy Saving Technology,2024

4. Experiment of Micro Refrigeration System for Electronic Chip Cooling [J];Chen;Electrotechnical Technique,2023

5. Research on liquid cooling technology of Data center [J];Ke;Design and Technology of Posts and Telecommunications,2023

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