New method to prepare corona resistant polyimide composite film

Abstract

Abstract Polyimide composite materials have gained considerable importance as high-performance polymers and matrices. These materials are used in microelectronic and electrical industries because of their excellent heat resistance, good chemical stability, and low thermal expansion. Polyimide films are mainly prepared by the flow casting method. Polyimide films are produced via dip coating method, and ion exchange method based on the surface of the polyimide can be etched and modified. The advantages and disadvantages of the existing production process of polyimide film were summarized. A new type of corona resistant polyimide composite film with a certain thickness of pure polyimide layer in the middle and a certain thickness of polyimide/alumina hybrid layer on the upper and lower surfaces is proposed aiming at the preparation of high-performance corona resistant polyimide composite film.