Research on performance of heat sink with no dielectric copper-aluminum connection

Abstract

Abstract Air-cooled copper-aluminum composite heat sink is generally used for heat dissipation of electronic components. If the traditional copper-aluminum connection mode is used, such as welding, copper plugging and locking, bad phenomena such as pores, impurities and interface thermal resistance easily occur on the bonding surface, resulting in decreased heat conduction efficiency, heat dissipation efficiency and lower strength of the bonding surface. Therefore, we introduce a mortise-tenon connected heat sink, and optimize the honeycomb structure of the heat dissipation fin to design a new type of air cooled heat sink with no dielectric copper-aluminum connection. CFD simulation software is used to study the heat dissipation performance of the traditional and new heat sink, and the obtained data are comparatively analyzed to verify feasibility of the process. The result shows that the mass of the honeycomb heat sink is reduced by 37.1%, the surface area is increased by 47.8%, and the heat dissipation performance of the new copper-aluminum heat sink is 60% higher than that of pure copper integrated heat sink. It is concluded that heat sink with mortise-tenon connection has superior performance than traditional integrated air cooled heat sink, and honeycomb heat sink has superior performance than solid plate heat sink.