Silicon coating deposition on NiTi substrate by plasma immersion ion implantation and deposition

Abstract

Abstract This paper studies the deposition of a silicon coating on a substrate of a nickel-titanium based alloy using plasma immersion ion implantation and deposition (PIII&D). It is shown that the PIII&D technique allows a nickel titanium substrate to be coated with an up to 3 μm thick amorphous silicon coating. The PIII&D time is found to have a decisive influence on the coating thickness. The magnitude of the bias voltage Us has a much smaller effect on the thickness of the sputtered coating. To ensure a high adhesion of the coating to the substrate, the substrate must be preheated before PIII&D to a temperature of ≈ 300°C.