Manufacturability Analysis and Research of PCB Component Mounting

Author:

Tian Lei,Wang Yixiao,He Chengyu,Mao Minhang,Chen Lulu

Abstract

Abstract In the traditional production mode, the disconnection between PCB design and manufacturing leads to many disadvantages such as more design rework, difficult processing, and high cost. To address this issue, this paper achieves manufacturability analysis at the PCB design stage by establishing a manufacturability analysis system for PCB component placement and simulating the placement process of the placement machine on the computer, taking into account the functional and process requirements of PCB board-level circuits simultaneously, so as to facilitate design decisions in the global tendency of the PCB manufacturing system to be optimal.

Publisher

IOP Publishing

Subject

Computer Science Applications,History,Education

Reference5 articles.

1. PCB Footprint Design for Surface Mount Components Based on IPC-7351B;Anju;Oranance Ind Auto.,2019

2. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging;Hou;IEEE J Emer Power Elect,2020

3. Overview of high voltage SiC power semiconductor devices: Development and application;Ji;CES Trans. Elect. Mach. Syst.,2017

4. Characterization of PCB embedded package materials for SiC MOSFETs;Hou;IEEE Trans. Compon. Packag. Manuf. Technol.,2019

5. Chip-first fan-out panel-level packaging for heterogeneous integration;Ko;IEEE Trans. Compon. Packag. Manuf. Technol.,2018

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