Dielectric layer of printed circuit boards formation using dendrimer morphology polyaluminosilicates

Abstract

Abstract Aluminosilicates with different molecular weights have been synthesized. A composite material based on aluminosilicates and highly dispersed filler powders with various filling degrees has been obtained. Viscosity values of the aluminosilicates with different molecular weights and composites based on them with highly dispersed AlO(OH) powders have been studied. The processes of mechanochemical mixing of the aluminosilicates with fillers have been studied. The interrelation between the molecular architecture of branched polyaluminosilicates functionalized by reactive groups and their self-organization in thin films and layers has been revealed. Samples with applied dielectric layers and coatings on aluminum bases have been produced. Thermal conductivity of the developed dielectric layers used in printed circuit boards on metal bases has been measured.