Mechanical properties analysis of cross-linked epoxy resin

Author:

Huang Ruodong,Gao Chao,Zhou Fusheng,Yu Jiahe,Yang Hao

Abstract

Abstract For this study, bisphenol A epoxy resin (DGEBA) was used as the resin matrix, and 3,3’-diaminodiphenyl sulfone (33DDS) was used as the curing agent. The effects of different cross-linking densities on the mechanical properties of epoxy resins were studied by molecular dynamics (MD) simulation, and the changes in the mechanical properties of epoxy resins under five different cross-linking density levels were predicted [1]. The results showed that as the cross-linking density of the epoxy resin increased, the mechanical parameters (such as elastic modulus, shear modulus, and bulk modulus) of the epoxy resin system also increased. This indicates the importance of improving the curing process of epoxy resin to enhance its mechanical properties.

Publisher

IOP Publishing

Reference10 articles.

1. Construction and performance simulation of cross-linked epoxy resin molecular model based on Perl language;Luxia;Journal of Computational and Applied Chemistry,2017

2. Study on the Interface between Single-wall Carbon Nanotubes and Epoxy Resin Materials [J];Thierry;Carbon,2016

3. Effect of Curing Agent Selection and Curing Temperature on Mechanical Properties of Bisphenol F Epoxy Resin Concrete [J];Jijin;Construction and Building Materials,2017

4. Effect of Reaction Characteristics of Primary and Secondary Amines on Structural Properties of Thermosetting Epoxy Resin: A Molecular Dynamics study [J];Estridge;Polymer,2018

5. Curing Kinetics and Thermal Characterization of Epoxy Rresin Cured with Amidodicarboxylic Acids [J];Mustata;Applied Thermal Engineering,2017

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