The Scalability of Third Generation Photovoltaics: Deposition Techniques and Modularity

Abstract

Abstract The development of third-generation photovoltaic (TGPV) technologies promises to address some of the limitations of conventional silicon-based solar cells. However, the scalability of these technologies is a critical factor in their practical application. TGPV include Perovskite Solar Cells (PSC), Organic Solar Cells (OSC), and Dye-Sensitized Solar Cell (DSSC). This paper reviews and summarizes the recent trends and research on the deposition techniques and modularity of TGPV. Various deposition techniques such as slot-die coating, thermal evaporation, and spray pyrolysis are discussed, along with their advantages and limitations. Modularity, which allows for the integration of TGPV cells into different structures, is also examined as a critical factor in scalability. The paper concludes that the scalability of TGPV technologies depends on the development of efficient and cost-effective deposition techniques and modularity, which will facilitate the integration of the TGPV cells into various structures and enable the widespread use of these promising technologies.