Blending Compatibility Simulation of UV-thermal Curing Solution with Epoxy Resin

Abstract

AbstractTo make a UV-thermal curing solution based on bisphenol A, epoxy acrylate (EA) and epoxy resin of diglycidyl ether of bisphenol A (DGEBA) were uniformly mixed. The Blends module in the Materials Studio software was used to carry out molecular dynamics simulation of blending compatibility and evaluate the rationality to achieve UV-thermal curing through interaction parameters, binding energy, and phase diagram. The binding energy distribution of DGEBA and EA is not consistent at 298 K, and the interaction parameter is 6.4335. When the temperature rises to 365 K, the interaction parameter diminishes to 3.5795. The compatibility of the UV thermal curing solution is improved by changing the molar ratio of DGEBA and EA to 0.45 and raising the temperature to 340 K. The results can be used to guide and predict the UV-thermal curing process and properties of epoxy resin.