Research on the simulation technology of the combined effects of transient thermal shock and a triaxial 6-DOF

Author:

Yao Zemin,Huang Xiaokai,Huang Shouqing,Liu Shouwen

Abstract

Abstract During the reentry of a spacecraft, it will encounter extreme environment of transient thermal shock and a triaxial 6-DOF. Currently, there is a lack of experimental verification means. Taking a second power supply as an example, the finite element simulation model is established, and the model is verified by the heat balance test and random vibration modal test. The thermal response distribution of rapid temperature change, low-temperature holding and high-temperature holding phrases is obtained through the transient thermal shock simulation; Based on the multi-stress simulation of the workbench, the stress-strain response distribution under the triaxial 6-DOF random vibration is obtained. According to the principle of stress coupling, the thermal response distribution matrix and stress-strain response distribution matrix are applied to the finite element model of electronic products at the same time, and then the transient thermal shock and the triaxial 6-DOF coupling simulation is realized, which provides a theoretical guidance for test verification of the extreme environment during the reentry of a spacecraft.

Publisher

IOP Publishing

Subject

General Physics and Astronomy

Reference18 articles.

1. Transient thermal impact research on turbine rotors based on thermoelastic coupling;Xu;Journal of Harbin Engineering University,2016

2. Experimental Investigation and CFD Simulation of Heat Transfer of Slot Film Cooling under Transient Thermal Shock Conditions;Ren;Journal of Propulsion Technology,2016

3. A study on the reliability of double-bump solder joints based on Patron and frequency domain analysis under random vibration load;Zhang;Journal of Vibration and Shock,2017

4. Thermal Shock Load Induced Space Structure’s Vibration Analysis Method;Kong;Computer Simulation,2014

5. Vibration characteristics of an axially moving beam under thermal shocks;Yang;Journal of Vibration and Shock,2017

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3