Discussion of Mechanical Shock Test Stress for Ultra-large-scale CMOS Image Sensors

Abstract

Abstract The ultra-large-scale CMOS image sensors are significantly different from the traditional CMOS image sensors in terms of pixel size, chip size and structure. CMOS image sensors generally come with an optical window structure that is sealed to the ceramic housing by means of adhesive. The optical window material is generally sapphire, and the larger the image element size, the larger the required glass optical window area. Ultra-large size CMOS image sensors in the package before the general optical window thickness, parallelism, light window average transmittance assessment. The object of mechanical impact test assessment is the CMOS image sensor optical window structure and capping process. The paper mainly discusses the typical failure cases of ultra-large-scale CMOS image sensors on the basis of the applicability of mechanical shock test standards, and investigates how to define the mechanical shock test stress from simulation, limit test and the requirements by users. This paper provides the qualification assessment basis of mechanical shock for newly developed products.