Simulation and Process Analysis of DLP 3D Printing with High-strength Resin

Abstract

Abstract By utilizing digital light processing (DLP) printing equipment and technology, this study investigates the temperature field, stress changes, and the impact of various process parameters on the formation and strength characteristics of high-strength resin during the printing process. Abaqus birth-death element method simulation and related process tests are employed for this purpose. The simulation results demonstrate a gradual decrease in the temperature field through wavy diffusion from the center to the boundary during printing. The node temperature, displacement, and stress curves are observed to fluctuate frequently due to the subsequent printing layers, with the maximum stress point located close to the printing platform. The experimental results reveal that the test parameters possess different effects on the surface quality and tensile strength. Inappropriate parameters tend to result in surface defects. The influencing factors on the tensile strength of the sample are ranked in the following order: layer thickness, exposure time, and exposure light intensity. The molded resin sample achieves a tensile strength of 58.5MPa, which is comparable to the tensile properties of traditionally injection-molded parts.