Abstract
Abstract
This paper aims to evaluate and analyze the performance and stability of super-junction IGBTs (Insulated Gate Bipolar Transistors) in high-temperature environments. The study begins with an overview of the significance of IGBTs in the field of power electronics. It provides a comprehensive discussion of the advantages of super-junction technology and the challenges posed by high temperatures on the performance of IGBTs. Through a series of experiments on various commercial super-junction IGBT models, this research thoroughly assesses the devices’ saturated current, threshold voltage, leakage current, switching time, and switching losses at different temperature points (25°C, 75°C, 125°C, and 175°C). The experimental results demonstrate a significant impact of high temperatures on the performance of IGBTs, particularly in terms of changes in saturated current and threshold voltage. Additionally, the study predicts the lifespan of super-junction IGBTs through High-Temperature Operating Life (HTOL) testing and analyzes the failure modes in high-temperature environments. The results indicate that the expected lifespan of the devices significantly decreases with increasing temperature, with primary failure modes including degradation of the gate oxide layer, an increase in interface traps, and disruption in conductive pathways. The paper also compares experimental results with existing literature, emphasizing the potential and importance of optimized design for super-junction IGBTs in high-temperature environments. The study suggests that improvements in materials, structural design, manufacturing processes, and innovative cooling technologies can further enhance the performance and stability of IGBTs in high-temperature applications. Finally, this research provides new insights into the development of super-junction IGBTs in high-temperature power applications and offers valuable references for professionals in related fields.