Author:
Zhang Haiyun,Wang Danyong,Liu Juncong,Wei Huazhen,Zhang Jianqin,Liu Fangbiao,Xu Jingli,Liu Aiyun,Wang Ronghui,Jia Huamin,Guo Jianfen,Li Fuqiang,Li Shuhu,Qin Zhenming,Liu Yadong
Abstract
Abstract
Due to the growing needs of thermal management in modern electronics, epoxy-based composites are increasingly demanded in heat dissipating materials. A simple preparation of composites with high thermalconductivity was developed through the graphenenanosheetshomogeneously dispersed in theepoxy matrix. A high thermal conductivityof 0.4843W/mK ( increased by184% over that of pure epoxy) could be obtained for the compositeswith a filler content of 5wt.%. It was proved that high aspect ratio of GNPs are critical issues of theconstitution of a special interface region between the GNPs and epoxy matrix of the composites.The more than mere additive effect on the through-thickness thermal conductivity suggests synergistic physical interactions between graphenenano sheets leading to further enhancement in the through-thickness thermal conductivity. Thus, the graphene-reinforced composites are promising for usageas an efficient heat spreader for heat dissipation applications.
Subject
General Physics and Astronomy